Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein

ABSTRACT

In a method for integrating a component ( 3 ) into a printed circuit board, the following steps are provided:
         providing two completed printed circuit board elements ( 1, 4 ), which more particularly consist of a plurality of interconnected plies or layers ( 6, 7, 8 ), wherein at least one printed circuit board element ( 4 ) has a cutout or depression ( 10 ),   arranging the component ( 3 ) to be integrated on one of the printed circuit board elements ( 1 ) or in the cutout of the at least one printed circuit board element, and   connecting the printed circuit board elements ( 1, 4 ) with the component ( 3 ) being accommodated in the cutout ( 10 ), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor ( 3 ) in a printed circuit board.       

     Furthermore, a printed circuit board of this type comprising an electronic component ( 3 ) integrated therein is provided.

This is a national stage of PCT/AT2011/000172 filed Apr. 11, 2011 andpublished in German, which has a priority of Austria, no. GM 236/2010filed Apr. 13, 2010, hereby incorporated by reference.

FIELD OF THE INVENTION

The present invention relates to a method for integrating an electroniccomponent into a printed circuit board, and a printed circuit board ofthis type, comprising an electronic component integrated therein.

PRIOR ART

In the context of the production of printed circuit boards having atleast one electronic component integrated therein, it is known toaccommodate such an electronic component in an, in particularmultilayer, circuit board, particularly by adapting such multilayercircuit board layers or plies surrounding the component, whereuponmethods known per se for connecting such, in particular different,layers of a multilayer circuit board are employed. In order to connectsuch layers or plies of a multilayer circuit board, such compositeassembly structures are usually subjected to elevated pressures and/ortemperatures to at least partially soften or melt at least layerscomprised of synthetic materials such as resins or the like, in order toensure the desired connection of the layers or plies and the embedmentof at least one electronic component in the printed circuit board. Sucha method for embedding an electronic component in a printed circuitboard, in which also the electronic component is subjected to suchmethod steps to produce the desired connections, will result in thecomplete sheathing or embedding of such a component within themultilayer circuit board, which is usually desired for a specific modeof construction of electronic components, by the softening or meltingof, in particular surrounding, synthetic layers. Known methods of thistype, in which an electronic component is immediately integrated duringthe formation of the multilayer structure of the printed circuit boardand subsequently subjected to appropriate treatment or processing stepsfor establishing the connection between the individual layers or pliesof a printed circuit board, are, however, not applicable unless such aconnection of the component with surrounding and, in particular,insulating materials is desired or acceptable.

An embodiment in which such an immediate embedding of an electroniccomponent is not desired or unrewarding has, for instance, become knownfrom GB-A 2 451 921, wherein an electronic component, for instance acapacitive microphone, is arranged on a multilayer circuit board. Forshielding, a metallic shield in the manner of a lid is fixed to themultilayer printed circuit board in separate and cumbersome additionaloperating steps following the arrangement of the component on themultilayer circuit board, wherein it is immediately apparent that such aseparate production and fixation of a shield formed, for instance, by ametal cage, which will, moreover, not allow for the protected and safeaccommodation of the component, involves considerable additionalexpenditures.

SUMMARY OF THE INVENTION

The present invention, therefore, aims to provide both a method forintegrating an electronic component into a printed circuit board, andsuch a printed circuit board comprising a component integrated orembedded therein, wherein the drawbacks of the prior art are avoided anda connection or substantially complete sheathing of such an integratedcomponent during subsequent processing or treatment steps of such aprinted circuit board are reliably avoided while ensuring protectedaccommodation of the component.

To solve these objects, a method of the initially-defined kind issubstantially characterized by the steps of:

-   -   providing two completed printed circuit board elements, which        more particularly consist of a plurality of interconnected        layers or plies, wherein at least one printed circuit board        element comprises a cutout or depression;    -   arranging the component to be integrated on one of the printed        circuit board elements or in the cutout of the at least one        printed circuit board element; and    -   connecting the printed circuit board elements with the component        being accommodated in the cutout.

In that, as in accordance with the invention, two completed printedcircuit board elements which, in particular, each consist of a pluralityof interconnected layers or plies are provided, wherein at least oneprinted circuit board element comprises a cutout or depression forsubsequently accommodating the component to be integrated into theprinted circuit board, it will be ensured that, during subsequenttreatment or processing steps of the printed circuit board, for instanceeven while connecting the two completed printed circuit board elements,a new or additional deformation of individual layers or plies of theprinted circuit board element will be reliably avoided, since, inparticular, no changes of the dimensions of the cutout or depressionwill occur or will have to be expected, which will secure theaccommodation of the electronic component in the assembled state of theprinted circuit board elements to be connected. It is thus essential forthe method according to the invention to provide the printed circuitboard elements to be made available for embedding or integrating theelectronic component as semi-finished or finished products with which,as opposed to known method controls during subsequent processing ortreating steps, no deformation or the like of individual layers of theprinted circuit boards need to be feared so as to avoid, in the regionof the cutout or depression, any deformation of the free space providedfor accommodating the electronic component. Depending on the propertiesof the electronic component to be integrated or accommodated, at leastone cutout is provided in at least one of the completed printed circuitboard elements in order to subsequently provide a sufficiently large andaccordingly fitted space of accommodation for the electronic componentto be accommodated, to protectedly accommodate the same therein, whenarranging and accommodating the electronic component in the at least onecutout. Instead of forming a cutout in just one printed circuit boardelement for accommodating the entire electronic component in saidprinted circuit board element in the assembled state, it is, of course,also possible to provide matching cutouts or depressions in both printedcircuit board elements, which, in the assembled and connected state,will provide the free space required for accommodating the electroniccomponent.

By using completed printed circuit board elements for accommodating theelectronic component, the individual mounting of modules can berenounced, in particular when using printed circuit board manufacturingprocesses known per se, since a plurality of printed circuit boardelements may each be provided or accommodated in a common carrierelement or a format adapted to a printed circuit board manufacturingline, as is known per se, such that, by connecting a plurality ofprefinished printed circuit board elements each accommodated in suchformats or carrier elements in a common manufacturing operation, aplurality of such modules each consisting of two previously completedprinted circuit board elements and an electronic component integratedtherein can be provided. The modules are subdivided or separated insubsequent processing or treatment steps, as is also known per se. Inthis manner, the expenditures involved in the production of, inparticular, large numbers of such modules will be further reduced.

For the simple and reliable accommodation of such an electroniccomponent to be integrated, and for the optionally required adaptationto the properties of such an electronic component to be integrated,and/or its field of application, it is proposed according to a preferredembodiment that the dimensions of the cutout are selected to exceed thedimensions of the component in at least one direction of extension ofthe component. Thus, not only the simple adaptation or the reliable andsimple accommodation of the electronic component in the at least onedepression or cutout will be ensured, but it will also be possible toprovide a free space adapted to the application properties of theelectronic component, as will be discussed in more detail below.

According to a further preferred embodiment, it is proposed that thedimensions of the cutout exceed the dimensions of the component in theat last one direction of extension by at least 5%, in particular atleast 15%, of the respective dimension of the component, wherein it isproposed according to a further preferred embodiment that the dimensionsof the cutout are selected to exceed the dimensions of the component inany direction of extension of the component. It will thereby be possibleto accommodate different electronic components in printed circuit boardelements provided, completed, and to be connected, according to theinvention.

In accordance with a further preferred embodiment, it is proposed by theinvention that the electronic component to be integrated is formed by asensor, for instance for determining the temperature, moisture,pressure, sound, brightness, acceleration, spatial position, compositionof gaseous or liquid media, a high-frequency element or the like. Inparticular due to the fact that, as already pointed out in detail above,two completed printed circuit board elements are provided, at least oneof which provides a cutout or depression for accommodating an electroniccomponent to be integrated, with the dimensions of the cutout preferablyexceeding the dimensions of the electronic component to be accommodated,such an electronic component in the form of a sensor for detecting ordetermining an extremely large plurality of different measurands can beused and reliably and safely integrated in a printed circuit board.

The method proposed according to the invention thus manages to integratein a printed circuit board, and for instance use in the context of MEMStechnology, the most different sensors.

As indicated above, it is possible, by configuring the electroniccomponent to be integrated as a sensor, to determine a differentplurality of measuring data, wherein coupling of the sensor to theexternal environment will be required for some of the measuring data. Inthis respect, it is proposed that at least one passage opening runninginto the cutout for accommodating the component to be integrated isformed in a printed circuit board element, as in correspondence with afurther preferred embodiment of the invention. In this manner, gaseousor liquid media can, for instance, be introduced through the passageopening provided by the invention into the free space in which thesensor is directly integrated in the printed circuit board, in order todetermine their composition and physical values such as the temperature,moisture, pressure, sound or the like.

In some cases, appropriate shielding of the sensor is required toprevent measuring data or values to be determined by the sensor frombeing affected by environmental influences. In this context, it isproposed according to a further preferred embodiment of the methodaccording to the invention that the electronic component, in its stateaccommodated in the cutout, is shielded from the external environment ofthe two printed circuit board elements and/or neighboring regions of theprinted circuit board elements.

In order to avoid influences by, for instance, electromagneticradiation, which may be derived from further components integrated inthe circuit board or from the external environment of the printedcircuit board, it is proposed according to a preferred embodiment thatshielding is at least partially provided by substantially fullsurface,conducting layers of the printed circuit board elements. Suchsubstantially full-surface, conducting layers not only can, forinstance, be used for establishing electromagnetic shielding in the formof a Faraday cage, but will also provide appropriate shielding againstexternal influences by preventing, for instance, gaseous or liquid mediafrom passing through such layers.

For the coupling or connection of individual conducting regionsaccommodated during the formation of the individual printed circuitboard elements for shielding the electronic component to be integrated,it is proposed according to a further preferred embodiment that, inorder to provide shielding against electromagnetic radiation in a mannersubstantially surrounding the component about its entire periphery,conducting regions of the printed circuit board elements used forshielding are additionally connected by conducting contact connectionsbetween the conducting regions of the printed circuit board elements.

In addition to the shielding against electromagnetic radiation byproviding electromagnetic shielding substantially surrounding anelectronic component to be integrated over its entire periphery in themanner of a Faraday cage, the substantially hermetically tight shieldingor encapsulation of such a sensor against external environmentalinfluences will be required in some forms of application, wherein, inparticular synthetic layers, which are for instance used as insulatingmaterials in multilayer circuit boards, will not comprise the necessaryimperviousness. It is, moreover, immediately apparent that in the regionof contact connections of the electronic component it will not bepossible, in order to avoid short-circuits, to use substantiallyfull-surface, conducting shields, which, because of their materialproperties, would optionally also provide appropriate shielding againstexternal environmental influences. In this respect it is proposedaccording to a further preferred embodiment, in order to ensureshielding against such environmental influences while, at the same time,provide safe contacting of the component, that, in the region of contactconnections of the component to be integrated, a layer of a hermeticallytight, non-conducting material is embedded in a printed circuit boardelement and a contact connection of the component is realized by blindholes formed through the hermetically sealing layer and filled with aconductive material, a plating or the like. Such hermetically sealinglayers or plies can be simply and reliably accommodated in a multilayercircuit board as a function of the intended position of the electroniccomponent to be integrated and will provide adequate hermetic sealingagainst environmental influences, particularly in the region of contactconnections of such components.

In the context of the increasingly sought miniaturization of componentsand even printed circuit board elements, and to further avoidinterference effects, it is, moreover, frequently aimed to arrange atleast parts of an evaluation unit of electronic sensors or components inas close a vicinity to such components or sensors as possible. In thiscontext, it is proposed according to a further preferred embodiment ofthe method according to the invention that evaluation electronics forthe component is integrated in the printed circuit board element onwhich the electronic component is supported, or to which the electroniccomponent is contact-connected. Such an additional integration of theevaluation electronics likewise in at least one of the printed circuitboard elements, and hence in the immediate vicinity of the electroniccomponent to be integrated, will, for instance, enable the evaluationelectronics to be adequately protected from environmental influencesdirectly with the component by being accommodated within the shielding.

For the particularly reliable and simple connection of the completedprinted circuit board elements to be connected after the accommodationof the electronic component, it is, moreover, proposed that theconnection of the printed circuit board elements in a manner known perse is performed by soldering, eutectic bonding, thermocompressionbonding, diffusion soldering, using a conductive adhesive and/orconducting or conductive adhesive films or the like, as incorrespondence with a preferred embodiment of the method according tothe invention. Such connecting methods are known per se in the contextof the manufacture of printed circuit boards so as to be immediatelyapplicable without having to elaborately modify or expand manufacturingprocesses for multilayer circuit boards. These connecting methods,moreover, ensure that changes in the structures of the completed printedcircuit board elements, which might possibly affect the free space to beprovided for accommodating the electronic component, are safely avoided.

In order to produce a cutout or depression in at least one printedcircuit board element, which will subsequently serve to accommodate theelectronic component, it is proposed according to a further preferredembodiment that the cutout is produced in the at least one printedcircuit board element by clearing a partial region of the printedcircuit board element after having connected printed circuit boardelement layers to be connected, using a material preventing the adhesionof said partial region. Such methods for producing cutouts or recessesor depressions by clearing partial regions of a multilayer circuit boardare known per se and can be incorporated in a particularly simple andreliable manner in the method according to the invention.

To solve the initially-mentioned objects, a printed circuit boardcomprising an electronic component integrated therein is, moreover,essentially characterized by

-   -   two completed printed circuit board elements, which more        particularly consist of a plurality of interconnected layers or        plies, wherein at least one printed circuit board element        comprises a cutout or depression; and    -   an electronic component arranged on one of the printed circuit        board elements or in the cutout of the at least one printed        circuit board element;

wherein the printed circuit board elements are connected or connectableafter the accommodation of the component in the cutout.

In this manner, it is possible in a simple and reliable fashion asalready pointed out above, to provide a printed circuit board comprisingan electronic component integrated therein, whereby it will, inparticular, be ensured that even after or during the connection of thecompleted printed circuit board elements no influence or impairment ofthe free space to be provided for accommodating the electronic componentneed to be feared.

For simply fitting in the component, and also adapt it to optionallydifferent purposes of use of the electronic component to be integrated,it is preferably proposed for the printed circuit board according to theinvention that the dimensions of the cutout for accommodating theelectronic component exceed the dimensions of the component in at leastone direction of extension thereof.

As already indicated above, it is proposed according to a preferredembodiment that the dimensions of the cutout exceed the dimensions ofthe component in at last one direction of extension by at least 5%, inparticular at least 15%, of the dimension of the component, wherein itmay be proposed according to a further preferred embodiment that thedimensions of the cutout are selected to exceed the dimensions of thecomponent in any direction of extension of the component. It willthereby be possible to provide an accordingly large free space foraccommodating the electronic component.

In order to determine different measuring data or values by using aprinted circuit board according to the invention, it is, moreover,proposed that the electronic component to be integrated is formed by asensor, for instance for determining the temperature, moisture,pressure, sound, brightness, acceleration, spatial position, compositionof gaseous or liquid media, a high-frequency element or the like, as incorrespondence with a further preferred embodiment of the printedcircuit board according to the invention.

In order to determine different physical and/or chemico-physicalproperties or parameters of gaseous or liquid media to be examined, itis, moreover, proposed according to a further preferred embodiment thatat least one passage opening running into the interior of the cutout foraccommodating the component is provided.

In order to provide shielding of the component against externalenvironmental influences, it is, moreover, contemplated that partialshielding of the component in its state accommodated in the cutout fromthe external environment and/or neighboring partial regions of theprinted circuit board is provided, as in correspondence with a furtherpreferred embodiment of the printed circuit board according to theinvention.

In particular in order to provide shielding against electromagneticradiation, it is contemplated according to a further preferredembodiment that said shielding is at least partially provided bysubstantially full-surface, conducting layers of the printed circuitboard elements. The integration of such substantially full-surface,conducting layers in the printed circuit board elements in this case ispossible in a simple and reliable manner, in particular when producingmultilayer printed circuit boards.

In order to achieve shielding substantially surrounding the electroniccomponent over its entire periphery, it is, moreover, preferablyproposed that conducting regions of the printed circuit board elementsused for shielding are additionally connected by conducting contactconnections between the conducting regions of the printed circuit boardelements. Such conducting contact connections can be produced in asimple and reliable manner by steps that are common and known in themanufacture of a printed circuit board.

In addition to shielding against, for instance, electromagneticradiation, particularly by using appropriately conducting materials tobuild a Faraday cage, shielding and sealing against gaseous or liquidmedia may be required in special cases of use of such an electroniccomponent or sensor to be integrated, wherein synthetic materials used,for instance, in the production of printed circuit boards may possiblynot comprise the required shielding effect against such substances. Inorder to achieve hermetically tight sealing effects also in the regionof contact connections of the electronic component to be integrated,where, in particular, materials conducting in full-surface fashion ormetallic materials, which would possibly have the required sealingproperties, cannot be used to avoid short-circuits or the like, it isproposed according to a further preferred embodiment that, in the regionof contact connections of the component to be integrated, a layer of ahermetically tight, non-conducting material is embedded in a printedcircuit board element and a contact connection of the component isrealized by blind holes formed through the hermetically sealing layerand filled with a conductive material, a plating or the like. Suchhermetically tight and, in particular, non-conducting materials also canbe integrated in a simple manner in the context of the manufacture ofprinted circuit board elements.

In order to simplify and assist the detection and evaluation of themeasurements provided by the electronic components or sensors, and alsoto enable further miniaturization, as small a spatial distance aspossible between the sensor, or the electronic component, and anevaluation electronics is desired or required, as already indicatedabove. In this respect, it is proposed that evaluation electronics forthe electronic component is integrated in the printed circuit boardelement on which the component is supported, or to which the electroniccomponent is contact-connected, as in correspondence with a furtherpreferred embodiment of the printed circuit board according to theinvention.

In order to achieve a reliable connection of the printed circuit boardelements, which will optionally also provide desired sealing properties,it is, moreover, preferably proposed for the printed circuit boardaccording to the invention that the connection of the printed circuitboard elements in a manner known per se is formed by soldering, eutecticbonding, thermocompression bonding, diffusion soldering, using aconductive adhesive and/or conducting or conductive adhesive films orthe like.

SHORT DESCRIPTION OF THE DRAWINGS

In the following, the invention will be explained in more detail by wayof exemplary embodiments schematically illustrated in the accompanyingdrawing.

Therein:

FIG. 1 is a schematic illustration of a printed circuit board comprisingan electronic component arranged thereon, according to the prior art;

FIG. 2 is a schematic illustration of a first inventive embodiment of aprinted circuit board comprising an electronic component integratedtherein and produced by the method according to the invention;

FIG. 3, in an illustration similar to that of FIG. 2, depicts a modifiedembodiment of a printed circuit board according to the invention, withan evaluation electronics being additionally provided in the immediatevicinity of the integrated electronic component;

FIG. 4, again in an illustration similar to that of FIG. 2, depicts afurther modified embodiment of a printed circuit board according to theinvention, with the component being arranged in the cutout provided in aprinted circuit board element; and

FIG. 5 is a schematic illustration of a further modified embodiment of aprinted circuit board according to the invention, wherein a hermeticseal is also provided in the region of contacts of the electroniccomponent to be integrated.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

From the configuration according to the prior art as is schematicallyindicated in FIG. 1, it is apparent that an electronic component 101 isarranged on a printed circuit board element 100, which may, forinstance, consist of a plurality of different layers or plies, which arenot shown in detail, wherein only two contacts 102 are schematicallyindicated. The electronic component 101 is, for instance, formed by amicrophone, wherein a metallic cage 103 is indicated to achieveappropriate shielding of the electronic component arranged on theprinted circuit board element 100, said cage being connected, viaconnections 104, to conducting elements not illustrated in detail.Further contact connections of the printed circuit board, or structuredconducting elements of the same, are schematically indicated by 105 and106.

According to the prior art, an electronic component 101 to beadditionally protected or shielded is thus arranged on a surface of aprinted circuit board, wherein, in the present case, which uses theelectronic component 101 as a microphone, a hole or passage opening 107for the sound to be recorded by the microphone 101 is indicated. It isimmediately apparent that this known embodiment not only involvesconsiderable additional expenditures for the subsequent production ofthe shield 103, which is, for instance, formed by a metal cage, but alsocan by no means ensure an adequately protected or safe accommodation ofthe electronic component 101.

In the embodiment according to the invention, which is represented inFIG. 2, an, in particular multilayer, printed circuit board element 1 isprovided similarly as in the prior art according to FIG. 1, to which anelectronic component 3 is again fixed via schematically indicatedcontacts 2.

Via connections 5, which will be discussed in more detail below, asecond printed circuit board elements 4 is connected to the previouslycompleted printed circuit board element 1, wherein a plurality ofdifferent layers or plies 6, 7, 8 and 9 are to be seen or indicated inthe second printed circuit board element 4. The likewise previouslycompleted printed circuit board element 4 is, moreover, formed with acutout or recess or depression 10, whose dimension in the embodimentillustrated in FIG. 2 exceeds the dimensions of the electronic component3 in any direction of extension, wherein the distances, or the freespace, between the component 3 and the boundary walls of the recess ordepression 10 are shown not true to scale but extremely large, inparticular to elucidate the illustration.

When again using the component 3 as a microphone, a passage opening orsound hole 11 is also provided in the printed circuit board 1 similarlyas in the embodiment according to FIG. 1.

In order to achieve appropriate shielding against electromagneticradiation of the component or microphone 3, a metallic cagesubstantially completely surrounding the component 3 is formed by asubstantially full-surface layer 12 of conductive material directlyconstituting a separation layer or ply of the previously completedmultilayer printed circuit board element 4, and by contact connections13 in the region of the contact connections or connections 5. Suchcontact connections 13 are formed by passage openings, which are knownin the production of printed circuit boards and are, for instance,likewise filled with conductive material or at least plated therewith.When providing a connection 5 likewise of conducting material, e.g. asolder connection 5, reliable shielding integrated in the printedcircuit board elements 1 and 4 will be immediately achieved uponconnection of the two printed circuit board elements 1 and 4 after thearrangement of the electronic component or sensor 3.

When embedding a microphone 3 as a component to be integrated,achievement of sound qualities of the component will, for instance, alsobe possible by renouncing the metallic shield to be separately arrangedas in the prior art according to FIG. 1, and embedding the component 3into the prefabricated printed circuit board elements 1 and 4.

Additional structures or contacts 14 and 15 as are provided in theembodiment according to the prior illustrated in FIG. 1 are also shownin the printed circuit board element 1.

In the configuration according to FIG. 3, a previously completed printedcircuit board element 21 is again provided as in the embodimentaccording to FIG. 2, on which an electronic component 23 is arranged soas to be supported by contacts 22.

To the printed circuit board element 1 is connected a second previouslycompleted printed circuit board element 24, which is again formed by amultilayer printed circuit board element, such multiple layers or pliesknown per se having been omitted from FIG. 3 for reasons of simplicity.

Similarly as in the preceding embodiment, a connection 25 is againprovided between the printed circuit board elements 21 and 24, whereinthe electronic component 23 is arranged in a recess or depression 26again provided in the printed circuit board element 24, whosedimensions, which are enlarged relative to the dimensions of thecomponent 23, are again illustrated in an exaggerated manner for thesake of clarity.

For an additional shielding to be again provided when, for instance,used as a microphone, a substantially full-surface layer of a conductivemetallic material in the printed circuit board element 24 is denoted by27, wherein passage openings 28 are again indicated to complete theshield similarly as in the preceding embodiment, which passage openingsagain provide shielding surrounding the electronic component 23 duringor after filling or at least plating with a conducting material, andwhen providing a connection 25 of conducting material.

A passage opening to the free space 29 defined by the recess 26, inwhich the component or sensor 23 is arranged or received or integrated,is denoted by 30.

In the embodiment illustrated in FIG. 3, it is additionally providedthat evaluation electronics 31 for the component is provided in theimmediate spatial vicinity and, in particular, integrated in the printedcircuit board element 21 such that, in view of the miniaturization ofsuch a modularly structured sensor directly integrated or integratablein a printed circuit board, the recording and/or evaluation of themeasuring data or measured values determined by the sensor 23 will beenabled.

In the further modified embodiment represented in FIG. 4, a printedcircuit board element 41 again consisting of several layers is providedwith a recess or depression 42, wherein an electronic component 43 isdirectly fixed in said recess 42 of the printed circuit board element 41via contacts 44. Similarly as in the preceding embodiment, evaluationelectronics 45 is again integrated in the printed circuit board element41 in the immediate vicinity of the component 43, a contact connectionbetween the component 43 and the evaluation electronics beingschematically indicated by 46. Also the embodiment according to FIG. 4comprises a passage opening 47 for connecting the sensor or component 43to the external environment.

Similarly as in the preceding embodiments, a further printed circuitboard element 48 is connected or coupled to the printed circuit boardelement 41 via connections 49, wherein, in order to provide shielding,passage openings 51 are again provided with the appropriate metallicplating or the like beside a layer or ply 50 of conducting material,similarly as in the preceding embodiments.

From the schematic illustration according to FIG. 5, it is apparentthat, as known per se in the manufacture of printed circuit boards, agreat plurality of similar elements are usually produced in a commoncarrier or an accordingly large format, wherein, after the completion ofthe individual printed circuit boards, the latter are subdivided intoindividual modules or elements.

In the embodiment according to FIG. 5, it is, moreover, indicated that,unlike in the preceding embodiments according to FIGS. 2 to 4, asubstantially hermetic seal of the electronic component to beaccommodated is to be provided.

To this end, a layer or ply 62 of hermetically sealing material such asglass, ceramic or the like is provided or integrated in an alreadycompleted printed circuit board element 61, which is again comprised ofa plurality of layers or plies, which are not illustrated in detail forthe sake of simplicity. Similarly as in the preceding embodiments, anelectronic component or sensor 63 is arranged in the printed circuitboard element 61 via schematic contacts 64, said electronic component 63being arranged or integrated in a recess 65 of a further printed circuitboard element 66. Connection between the printed circuit board elements61 and 66 is effected via schematically indicated connections 67.

In contrast to the preceding embodiments, the embodiment illustrated inFIG. 5 requires hermetic sealing of the component or sensor 63 againstthe external environment, wherein, in addition to the seal comprised ofthe hermetically sealing material 62, a plating 68 is provided in theprinted circuit board element 66, which plating also extends into therespective passage holes or openings 69 in the region of the connections67. By providing a continuous plating or full-surface material layer ofa metallic material, adequate tightness will be provided, enabling afull-surface sheathing or shielding of the component 63 by the sealcomprised of the material 62.

In the region of the hermetically sealing material 62, feedthroughs 70are provided by suitable bores or blind holes penetrating thehermetically tight material 62. In this manner, adequate hermeticsealing of the component 63 can also be provided in the region of thecontacts to be mutually separated.

The printed circuit board element 61, in addition to the feedthroughs70, comprises slots or bores or passages 73 penetrating the material 62,which, similarly as the holes 69, are, for instance, galvanically platedto complete hermetic shielding in addition to electromagnetic shielding.

In FIG. 5, a separation line 72 for separating adjacent modules is,moreover, provided after the completion of the individual modules, onlythe printed circuit board elements 61 and 66, respectively, beingschematically indicated for the adjacent module.

As opposed to the shown illustrations, it is known that such electroniccomponents comprise an extremely large plurality of contacts or contactsites, wherein substantially only two contacts 2, 22, 44 and 64 arerespectively indicated in the illustrations for the sake of simplicity.

It is, moreover, not necessarily required, in particular as a functionof the purpose of use or application of the electronic component 3, 23,43 or 63, as is shown in the illustrations particularly for reasons ofelucidation, that the free spaces formed by the respective recesses ordepressions 10, 26, 42 or 65 exceed by the extent shown the dimensionsof the electronic component 3, 23, 43 or 63 to be respectivelyaccommodated.

It may also be provided that the dimensions of the respective recess ordepression 10, 26, 42 or 65 is substantially adapted to the dimensionsof the component 3, 23, 43 or 63 to be accommodated or integrated suchthat the component will be received in the respective recess ordepression in a substantially precisely fitting manner. What isessential is that by respectively providing completed printed circuitboard elements 1, 4, 21, 24, 41, 48 or 61 and 66, the dimensions of thefree space defined by the recesses 10, 26, 42 or 65 will be maintainedunchanged.

To provide a connection 5, 25, 49, 67 of the printed circuit boardelements 1, 4, 21, 24, 41, 48 or 61 and 66 to be connected, it will alsobe possible, besides a solder connection as indicated above, to realizesuch a connection by eutectic bonding, thermocompression bonding,diffusion soldering, or a connection using a conductive adhesive and/orconducting or conductive adhesive films, if shielding of conductingmaterials is required. Unless such continuous shielding of the componentof conducting material, for instance by forming a Faraday cage, isrequired, adhesive connections of non-conductive materials may, forinstance, also be provided.

Besides the configuration, for instance, as a microphone of theelectronic component 3, 23 or 43 to be integrated or accommodated, towhich end a passage opening 11, 30 or 47 in the form of a sound hole isrespectively provided, such components can also be used to determineother physical values such as, e.g., the temperature, moisture,pressure, brightness or, in general, the composition of gaseous orliquid media. Alternatively, the electronic component may be comprisedof a high-frequency element.

In an embodiment according to FIG. 5, in which a substantially hermeticseal is provided, an acceleration sensor or position sensor or any othertype of sensor for which shielding against environmental influences orinfluences from the external environment has to be safely provided may,for instance, be integrated in the free space provided by the cutout orrecess.

In addition to shielding the component or sensor 3, 23, 43 or 63 fromenvironmental influences, shielding may also be used to protect furtherelements or components of a printed circuit board region not illustratedin detail in the drawings, if, for instance, the determination of thecomposition of aggressive media in the region of the electroniccomponent 63 is to be performed.

Overall, embedding of the components or sensors 3, 23, 43 or 63 iseffected using method steps that are generally known in the manufactureof printed circuit boards.

1-25. (canceled)
 26. A method for integrating an electronic component into a printed circuit board, comprising the following the steps of: providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected layers or plies, wherein at least one printed circuit board element comprises a cutout or depression; arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element; and connecting the printed circuit board elements with the component being accommodated in the cutout, wherein evaluation electronics for the component is integrated in the printed circuit board, that the electronic component, in its state accommodated in the cutout, is shielded from the external environment of the two printed circuit board elements and/or neighboring regions of the printed circuit board elements and that, in the region of contact connections of the component to be integrated, a layer of a hermetically tight, non-conducting material is embedded in a printed circuit board element and a contact connection of the component is realized by blind holes formed through the hermetically sealing layer and filled with a conductive material, a plating or the like.
 27. The method according to claim 26, wherein the dimensions of the cutout are selected to exceed the dimensions of the component in at least one direction of extension of the component.
 28. The method according to claim 27, wherein the dimensions of the cutout exceed the dimensions of the component in the at last one direction of extension by at least 5%, in particular at least 15%, of the respective dimension of the component.
 29. The method according to claim 27, wherein the dimensions of the cutout are selected to exceed the dimensions of the component in any direction of extension of the component.
 30. The method according to claim 26, wherein the electronic component to be integrated is formed by a sensor, for instance for determining the temperature, moisture, pressure, sound, brightness, acceleration, spatial position, composition of gaseous or liquid media, a high-frequency element or the like.
 31. The method according to claim 26 wherein at least one passage opening running into the cutout for accommodating the component to be integrated is formed in a printed circuit board element.
 32. The method according to claim 26, wherein shielding is at least partially provided by substantially full-surface, conducting layers of the printed circuit board elements.
 33. The method according to claim 32, wherein conducting regions of the printed circuit board elements used for shielding are additionally connected by conducting contact connections between the conducting regions of the printed circuit board elements.
 34. The method according to claim 26, wherein the evaluation electronics for the component is integrated in the printed circuit board element on which the electronic component is supported, or to which the electronic component is contact-connected.
 35. The method according to claim 26, wherein the connection of the printed circuit board elements in a manner known per se is performed by soldering, eutectic bonding, thermocompression bonding, diffusion soldering, using a conductive adhesive and/or conducting or conductive adhesive films or the like.
 36. The method according to claim 26, wherein the cutout is produced in the at least one printed circuit board element by clearing a partial region of the printed circuit board element after having connected printed circuit board element layers to be connected, using a material preventing the adhesion of said partial region.
 37. A printed circuit board comprising an electronic component integrated therein, comprising: two completed printed circuit board elements, which more particularly consist of a plurality of interconnected layers or plies, wherein at least one printed circuit board element comprises a cutout or depression; and an electronic component arranged on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element; wherein the printed circuit board elements are connected or connectable after the accommodation of the component in the cutout, wherein evaluation electronics for the component is integrated in the printed circuit board, that partial shielding of the component in its state accommodated in the cutout from the external environment and/or neighboring partial regions of the printed circuit board is provided and that, in the region of contact connections of the component to be integrated, a layer of a hermetically tight, non-conducting material is embedded in a printed circuit board element and a contact connection of the component is realized by blind holes formed through the hermetically sealing layer and filled with a conductive material, a plating or the like.
 38. The printed circuit board according to claim 37, wherein the dimensions of the cutout for accommodating the electronic component exceed the dimensions of the component in at least one direction of extension thereof.
 39. The printed circuit board according to claim 38, wherein the dimensions of the cutout exceed the dimensions of the component in at last one direction of extension by at least 5%, in particular at least 15%, of the dimension of the component.
 40. The printed circuit board according to claim 38, wherein the dimensions of the cutout are selected to exceed the dimensions of the component in any direction of extension of the component.
 41. The printed circuit board according to claim 37, wherein the electronic component wherein to be integrated is formed by a sensor, for instance for determining the temperature, moisture, pressure, sound, brightness, acceleration, spatial position, composition of gaseous or liquid media, a high-frequency element or the like.
 42. The printed circuit board according to claim 37, wherein at least one passage opening running into the interior of the cutout for accommodating the component is provided.
 43. The printed circuit board according to claim 37, wherein shielding is at least partially provided by substantially full-surface, conducting layers of the printed circuit board elements.
 44. The printed circuit board according to claim 43, wherein conducting regions wherein of the printed circuit board elements used for shielding are additionally connected by conducting contact connections between the conducting regions of the printed circuit board elements.
 45. The printed circuit board according to claim 37, wherein the evaluation electronics for the electronic component is integrated in the printed circuit board element on which the component is supported, or to which the electronic component is contact-connected.
 46. The printed circuit board according to claim 37, wherein the connection of the printed circuit board elements in a manner known per se is formed by soldering, eutectic bonding, thermocompression bonding, diffusion soldering, using a conductive adhesive and/or conducting or conductive adhesive films or the like. 